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| Temperature Estimation on PCB Boards | Forced and Free Convection Cooling |
| Design Optimization of Heat-sink |
Fan Performance & Location Specification for forced Cooling |
| Thermal
shock response |
Hot
& Cold Chamber Test Simulation |
| Air Flow mapping in electronic
enclosure |
Thermal Cycling - Transient
Calculations |
| Estimate
Thermal deformation |
Integrated
Fan Motor Cooling calculations |
| Compliance checking to SEMI, IEEE,
JEDEC, EIA Standards |
Automotive, Aero-space, Naval
electronic (ship board) applications |
| IC
package location optimization |
Closely
spaced circuit boards Temperature Regulation |
| Assembly
subjected to Sine, Random, SOR excitations |
Field
Data Replication including Seismic |
| Constant and Variable Acceleration Excitation Levels |
Response to Mechanical Shock and
Impulse |
| Elastomeric
mount/ isolator design validation |
MIL
STD, IEC, IEEE, UL, CE, ASTM, FCC SAE, NAVSEA DDAM among other Standards |
| Drop Test |
Coupled Thermo mechanical analyses |
| Estimate
Natural Frequencies |
Aero-space,
Naval and Defence applications |
EGS India has been the preferred choice of Engineering Service
provider for performing FEA by Electronics and Electrical Device
Manufacturers for many reasons. Some of the are:
